Imax – Input current in Amperes at Qc=0, ΔT=ΔTmax;
Qmax – Maximum heat pumping capacity in Watts at ΔT=0, I=Imax;
Vmax – DC input voltage in Volts at Qc=0, I=Imax;
ΔTmax – Maximum temperature difference in K at Qc=0, I=Imax;
Th - Temperature at hot side.
| Option | Sign | Contents | Standard or Additional |
| Internal melting point | - | 138°C (lead free) | Standard |
| T1 | 183°C | Additional | |
| T2 | 230°C (lead free) | ||
| Operating temperature | Maximum operating temperature to be accepted as 2/3 value of the melting point | ||
| Ceramic | Aluminium oxide Al2O3 | Standard | |
| D | "Hot" ceramic plate has a porch for the lead wires | Additional | |
| P | External surfaces of the ceramic plates have copper plates, with disposition repeating pattern of internal surface | ||
| N | Aluminium nitride | ||
| Ceramic metallization | - | no | Standard |
| M | Metallization of the "hot" side surface | Additional | |
| cM | Metallization of the "cold" side surface | ||
| MM | Metallization of both "hot and cold" side surfaces | ||
| prt | Metallization is pretinned | ||
| Thickness tolerance | ±0,3mm | Standard | |
| Other options are available on agreement | Additional | ||
| Wire | Type, insulation and length of the wires to be agreed according to the type and requirements | ||
| Parallelism | 0.05 mm | Standard | |
| 0.02 mm | Standard | ||
| Other options are available on agreement | Additional | ||
| Sealing or additional protection | - | no | Standard |
| Lq | Inner surface of the module and module elements are covered with lacquer | Additional | |
| S | module sealed with silicon sealant on perimeter | ||
| eS | module sealed with epoxy compound on perimeter | ||
| Reliability | G | "cold" ceramic plate is glue bounded | Additional |
| Central hole | H | Module with central hole | Additional |
| Thermo sensor | td | Module with thermistor | Additional |
| Form | R | Round module | Additional |
Also see TEM designation
See Design (construction) TEM
